LTGC-CFZ-K Series Glass high-precision Fiber Optic Cutting Machine

LTGC-CFZ-K: Ultra-Fine Glass & Sapphire Fiber Optic Cutting Machine

Engineered for the most delicate tasks, the CFZ-K utilizes an advanced Picosecond ultrafast laser. This technology performs “cold ablation,” vaporizing material with virtually no heat transfer to the surrounding area. This allows for flawlessly smooth, chip-free cutting of transparent and ultra-hard materials like glass, sapphire, and diamond, which are impossible to process cleanly with conventional lasers.

 

 

▸ Product Introduction


 

The CFZ-K Series, meticulously engineered for the most precise tasks, harnesses the cutting-edge power of an advanced Picosecond ultrafast laser. This innovative technology performs remarkable “cold ablation,” efficiently vaporizing material without generating any significant heat transfer to adjacent areas. Consequently, it enables impeccable, smooth, and chip-free cutting of transparent and ultra-hard materials such as glass, sapphire, and even diamond – a feat that conventional lasers have struggled to achieve due to their inadequate processing capabilities.

 

▸ Product Features


 

  • ✅ Key Technology: Picosecond Ultrafast Laser

  • ✅ Best For: Glass, sapphire, diamond, sensitive polymers

  • ✅ Core Feature: “Cold” cutting with zero thermal stress for perfect edge quality.

 

▸ Product Parameters


 

Model     CFZ0305LCFZ0604L CFZ0606L
Processing area (L*W)500mm*300mm600mm*400mm600mm*600mm
X-axis travel305mm405mm605mm
Y-axis travel505mm605mm605mm
Z-axis travel50mm50mm50mm
X/Y axis repeat positioning accuracy≤0.005mm≤0.01mm≤0.01mm
Maximum compound speed30m/min30m/min30m/min
Maximum acceleration1.0G1.0G1.0G
Laser powerPicosecond 30-150W OptionalPicosecond 30-150W OptionalPicosecond 30-150W Optional
Chuck load-bearing≤200KG≤200KG≤200KG
Machine weight2500Kg2800Kg3000Kg
Machine Dimensions1900mm*1450mm*1800mm1900mm*1450mm*1800mm2150mm*1900mm*1800mm

 

> Industry-Leading Applications:

 

  • Medical Devices: Manufacturing of stents, surgical tools, implants, and diagnostic components.

 

  • Electronics (3C): Cutting phone frames, internal components, and semiconductor materials.

 

  • Aerospace & Defense: Prototyping and production of complex, lightweight components.

 

  • Automotive: Precision cutting of fuel injector nozzles, sensors, and interior parts.

 

  • Jewelry & Watchmaking: Intricate cutting of precious metals and watch components.

 

  • Scientific Research: Fabrication of custom lab equipment, microfluidics, and optical components.

 

 

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