LTGC-CFZ-C Series: Precision Ceramic & Brittle Material Laser Cutting Machine

LTGC-CFZ-C Series Ceramic high-precision Fiber Optic Cutting Machine

The CFZ-C is specially equipped with a Quasi-Continuous Wave (QCW) fiber laser, ideal for processing brittle and high-reflectivity materials like ceramics. The QCW laser provides high peak power with low thermal input, minimizing the heat-affected zone (HAZ) to prevent micro-cracking and ensure a perfect, clean-cut edge on materials like alumina and zirconia.

 

 

▸ Product Introduction


 

The LTGC CFZ-C Series are distinctively outfitted with a Quasi-Continuous Wave (QCW) fiber laser, rendering it perfectly suited for processing delicate and high-reflectivity materials such as ceramics. The QCW laser delivers robust peak power while maintaining minimal thermal input, effectively reducing the heat-affected zone (HAZ). This innovative feature mitigates the risk of micro-cracking and ensures the attainment of a flawless, clean-cut edge on materials like alumina and zirconia, thereby enhancing the overall quality and precision of the processing outcomes.

 

▸ Product Features


 

  • ✅ Key Technology: 

  • Quasi-Continuous Wave (QCW) Fiber Laser

  • ✅ Best For: 

  • Alumina ceramics, Zirconia ceramics, silicon wafers

  • ✅ Core Feature: 

  • Minimal heat damage for clean, crack-free cutting of brittle materials.

 

▸ Product Parameters


 

ModelCFZ0305C CFZ0604C  CFZ0606C
Processing area (L*W)500mm*300mm600mm*400mm600mm*600mm
X-axis travel305mm405mm605mm
Y-axis travel505mm605mm605mm
Z-axis travel50mm50mm50mm
X/Y axis repeat positioning accuracy≤0.01mm≤0.015mm≤0.02mm
Maximum compound speed30m/min30m/min30m/min
Maximum acceleration1.0G1.0G1.0G
Laser powerQCW150-600w OptionalQCW150-600w OptionalQCW150-600w Optional
Chuck load-bearing≤200KG≤200KG≤200KG
Machine weight2500Kg2800Kg3000Kg
Machine Dimensions1900mm*1450mm*1800mm1900mm*1450mm*1800mm2150mm*1900mm*1800mm

 

> Industry-Leading Applications:

 

  • Medical Devices: Manufacturing of stents, surgical tools, implants, and diagnostic components.

 

  • Electronics (3C): Cutting phone frames, internal components, and semiconductor materials.

 

  • Aerospace & Defense: Prototyping and production of complex, lightweight components.

 

  • Automotive: Precision cutting of fuel injector nozzles, sensors, and interior parts.

 

  • Jewelry & Watchmaking: Intricate cutting of precious metals and watch components.

 

  • Scientific Research: Fabrication of custom lab equipment, microfluidics, and optical components.

 

 

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